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Core Technology

Silicon Photonics

[Silicon photonics integration]

Silicon photonics integrates optical and electronic devices on silicon to enable efficient transmission and processing of signals in the optical domain. Compared with traditional electrical interconnects, it offers ultra-high bandwidth, ultra-low power, and compact footprint—a key technology for removing data-transfer bottlenecks in data centers, high-performance computing, and AI clusters.

Optical Circuit Switching (OCS)

[OCS optical switching overview]

Beeplux's in-house Optical Circuit Switching (OCS) technology enables high-speed, low-latency data transport with all-optical paths and supports dynamic topology reconfiguration. Optimized for large "elephant flows," it is well suited for AI training and other high-performance workloads. We have mass-produced 8×8 OCS chips and are scaling toward 128×128 to build next-generation, high-port-count, low-power optical interconnect architectures.

High-Speed Compute Interconnect

[Optical I/O (OIO) chiplet]

Beeplux provides leading high-speed optical interconnect technologies spanning 400G to 1.6T optical engines, with advanced Co-Packaged Optics (CPO) capabilities and ongoing development of Optical I/O (OIO) chiplets. Our interconnect solutions enable high-bandwidth, low-power communication between switching silicon and compute silicon, compatible with PCIe, Ethernet, and various proprietary protocols—significantly increasing bandwidth between chips and boards to accelerate data centers, AI clusters, and cloud-scale systems.

Packaging options: Supports Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) advanced packaging.

Core Process & IP

[Core process and IP]

We own key processes and proprietary IP spanning design through manufacturing:

  • Multi-wavelength integrated light source technology
  • Advanced packaging (high-density silicon interposers, opto-electronic co-packaging)
  • SiON (silicon oxynitride) process for polarization-insensitive devices
  • Heterogeneous integration of III-V materials with silicon photonics
  • Low-loss waveguides and high-speed modulator design

Products

We deliver a portfolio of products built on leading silicon photonics, designed to overcome conventional interconnect bottlenecks and meet next-generation data communication needs—helping customers build efficient and reliable optical interconnect infrastructure.

OCS Optical Switch Series

[OCS switch product]

We offer OCS products from board-level 8×8 up to 128×128 optical cross-connects to enable high-speed GPU-to-GPU interconnects, with a roadmap toward 1024×1024 architectures. Key advantages include temperature insensitivity, polarization insensitivity, low insertion loss, and fast switching. Built on a non-blocking architecture and supporting hot-swap, our systems are designed for stable operation in complex data-center environments and meet the stringent bandwidth and reliability requirements of hyperscale AI clusters.

High-Speed Optical Transceiver Engines

[Optical interconnect module overview]

We provide 400G, 800G, 1.6T, and higher-rate optical engines and modules, compatible with mainstream interfaces such as PCIe and Ethernet. Core offerings include multi-protocol, high-density, low-power optical I/O chiplets supporting NPO/CPO advanced packaging—delivering flexible and efficient optical interfaces for compute and networking equipment.

Silicon Photonics FMCW LiDAR

[Silicon photonics FMCW LiDAR]

Built on silicon photonics, this product replaces the complex fiber structures found in traditional FMCW systems to achieve high integration and significant cost reduction. It supports high-precision ranging within 100 meters and can be customized for scanning methods (e.g., semi-solid-state scanning), ranging accuracy (down to sub-millimeter), and target statistics.

Solutions

Optical Switching Network Architecture for Compute Clusters

[Optical switching network architecture]

By introducing a hybrid optical-electrical switching architecture, OCS handles sustained high-bandwidth "elephant flows" while traditional electrical switching handles bursty, small "mice flows." This approach can significantly reduce data-center hardware counts (e.g., Spine switches and optical modules), lowering overall power consumption and latency and improving total cost of ownership.

Benefits: Compared with all-electrical architectures, it can reduce electrical switch counts by up to 87%, cut power by ~40%, and reduce latency by ~10% (based on Google Apollo OCS case study).

AI/HPC Cluster Interconnect Acceleration

[AI/HPC optical interconnect illustration]

To address communication bottlenecks in large-scale GPU/accelerator clusters for AI training and HPC, our OCS solutions provide a dynamically reconfigurable, high-speed direct-connect network. Across tensor parallel (TP), pipeline parallel (PP), and data parallel (DP) training, OCS optimizes communication paths, reduces cross-node latency, and significantly improves training efficiency and compute utilization.

Use cases: Parallel training optimization for GPT-3, BERT, Switch Transformer, long-context models, and more.

Modular High-Performance Sensing

[Modular high-performance sensing]

For sensing in complex environments, we provide modular, high-precision sensor solutions covering wide-range wind measurement, millimeter-level ranging beyond 100 meters, in-field speed measurement, and MHz-level picometer vibration detection. Our products emphasize high reliability and customization for a broad range of intelligent systems and industrial applications.

Applications: Smart manufacturing, unmanned systems, smart cities, environmental monitoring, structural health monitoring, and more.

About Us

Company Overview

Beeplux Semiconductor was founded in 2022 as a high-tech company focused on silicon photonics R&D and productization, aiming to become a global leader in optical interconnect solutions. We are among a small group of companies building a mass-production-ready, end-to-end silicon photonics capability, addressing compute interconnect bottlenecks in the era of big data and AI.

Core Strengths

[Beeplux core strengths]
  • Full-stack capability: From silicon photonics IC design and key device development to OCS architectures, advanced opto-electronic packaging, and system-level deployment.
  • Strong R&D team: 35+ experienced engineers and researchers, including 10+ PhDs and multiple industry veterans, with 150+ years of combined silicon photonics experience.
  • Proprietary IP: 65+ core IP assets (25 granted; 20+ under review), forming a strong technology moat.
  • Manufacturing readiness: Mature production processes and supply-chain management, collaborating with leading global foundries and OSAT partners to scale silicon photonics deployment.
  • Global footprint: R&D presence in the U.S., Beijing, Shanghai, and more—bringing together top global talent.

Leadership & Core Team

[Core team]
  • Beeplux has a seasoned core team with members from leading global organizations such as Intel, IMEC, and Xanadu, with deep expertise across silicon photonics, optical communications, and semiconductor devices.
  • The team has led multiple silicon photonics ICs to mass production with shipments exceeding one million units, spanning the full flow from design, packaging to validation and deployment. Technical leaders have published 30+ papers; packaging experts have improved mass production efficiency for silicon photonics modules; and system leaders have driven LiDAR product development through commercialization.
  • With 65+ core IP assets across detectors, OIO interconnect, ring resonators, and more, we are building one of the few mass-production-grade vertical silicon photonics ecosystems and accelerating large-scale adoption.
  • This combination of innovation, execution, and strategic vision enables Beeplux to keep pushing the boundaries and steadily move toward industry leadership in silicon photonics.

Our Partners

We collaborate with leading companies and research institutions worldwide to advance the silicon photonics ecosystem:

Enflame Sitrus H3C Inspur SITRI ICRD Qingxin Semiconductor

News

Breakthrough in Large-Port-Count OCS: Beeplux Selected for Shanghai Strategic Frontier Program

The Shanghai Science and Technology Commission's Strategic Frontier Program includes three silicon photonics directions: optical switching, optical interconnect, and optical computing. The optical switching track—focused on scalable optical switching chips and systems—is undertaken by Beeplux Semiconductor. >>Read more

Contact

We look forward to connecting with you and exploring the potential of silicon photonics in data centers, AI, and high-performance computing. Please reach out for inquiries and collaboration.

Beeplux Semiconductor
Address: 7th Floor, Building 5, No. 799 Dangui Road, Pudong New Area, Shanghai
Tel: 021-58335358
Email: hr@bpstc.com
Website: https://bpstc.com
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